TY - JOUR
T1 - Modeling of curing process and residual stress analysis of thick-section thermosetting composites
AU - Li, Yongshan
AU - Chen, Guangchang
AU - Ge, Jingran
AU - Liu, Kai
AU - Liang, Jun
N1 - Publisher Copyright:
© The Chinese Society of Theoretical and Applied Mechanics and Springer-Verlag GmbH Germany, part of Springer Nature 2025.
PY - 2026/1
Y1 - 2026/1
N2 - The curing behavior of composites significantly influences their performance, making it crucial to understand the curing process. This study experimentally measured specific heat capacity, thermal conductivity, glass transition temperature, coefficient of thermal expansion, and cure shrinkage of materials. A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments. The effects of thickness, heating rate, and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.
AB - The curing behavior of composites significantly influences their performance, making it crucial to understand the curing process. This study experimentally measured specific heat capacity, thermal conductivity, glass transition temperature, coefficient of thermal expansion, and cure shrinkage of materials. A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments. The effects of thickness, heating rate, and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.
KW - Curing Behavior
KW - Residual stress field
KW - Thick-section composite
UR - http://www.scopus.com/pages/publications/105006522307
U2 - 10.1007/s10409-024-24411-x
DO - 10.1007/s10409-024-24411-x
M3 - Article
AN - SCOPUS:105006522307
SN - 0567-7718
VL - 42
JO - Acta Mechanica Sinica/Lixue Xuebao
JF - Acta Mechanica Sinica/Lixue Xuebao
IS - 1
M1 - 424411
ER -