TY - GEN
T1 - A Robust Electrothermal Micromirror Array based on Polyimide/Al Bimorphs
AU - Yang, Hengzhang
AU - Liu, Qiangqiang
AU - Ni, Jihui
AU - Jiao, Wenlong
AU - Mao, Xiaodan
AU - Ding, Yingtao
AU - Ren, Anrun
AU - Zhao, Hui
AU - Zhang, Shuailong
AU - Xie, Huikai
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - MEMS micromirrors are fragile and require careful handling to work in harsh environments and survive accidental falls or external impacts, which is especially critical for micromirror arrays, where multiple units must work jointly. This paper presents a robust 4 × 4 electrothermal micromirror array, constructed with bimorph beams made of Al and photosensitive polyimide (PSPI). The low Young's modulus of PSPI combined with the high ductility of Al enables this micromirror array to withstand impacts exceeding 1600 g. Additionally, this micromirror array demonstrates exceptional tip-tilt-piston scanning capabilities, positioning it as a promising candidate for applications in optical phased array modulation and optical cross-connect.
AB - MEMS micromirrors are fragile and require careful handling to work in harsh environments and survive accidental falls or external impacts, which is especially critical for micromirror arrays, where multiple units must work jointly. This paper presents a robust 4 × 4 electrothermal micromirror array, constructed with bimorph beams made of Al and photosensitive polyimide (PSPI). The low Young's modulus of PSPI combined with the high ductility of Al enables this micromirror array to withstand impacts exceeding 1600 g. Additionally, this micromirror array demonstrates exceptional tip-tilt-piston scanning capabilities, positioning it as a promising candidate for applications in optical phased array modulation and optical cross-connect.
KW - Electrothermal Actuation
KW - Electrothermal Bimorph
KW - MEMS
KW - Micromirror Array
KW - Photosensitive Polyimide
UR - http://www.scopus.com/pages/publications/105001664822
U2 - 10.1109/MEMS61431.2025.10918047
DO - 10.1109/MEMS61431.2025.10918047
M3 - Conference contribution
AN - SCOPUS:105001664822
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 724
EP - 727
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -