A Contactless DC Current Sensor Based on Thin-Film Lithium Niobate S0-Mode Lamb Wave Resonator

Wenwei Gao, Hanlun Guan, Huikai Xie, Feng Gao*, Xiaoyi Wang*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This paper present a novel contactless DC current sensor based on a high frequency S0-mode Lamb wave resonator fabricated on a lithium niobate on insulator (LNOI) substrate, which offers high sensitivity and high Q-value. This current sensor is constructed by mounting a self-aligned micro-magnet on a microcantilever, which also integrates a thin-film Lamb wave resonator serving as a strain sensor. In this design, the magnetic force exerted on the permanent magnet by the DC-current excited magnetic field results in strain on the microcantilever structure. This strain is then detected through the frequency shift of the Lamb wave resonator, allowing for accurate measurement of the current magnitude. The Lamb wave resonator and the microcantilever was fabricated on a LNOI wafer through electrode lift-off and a two-step back-etching process. A 2-μm nickel layer was patterned on the tip of the microcantilever, allowing for the self-alignment of the magnet on the microstructure through the attractive force. The thin-film S0-mode Lamb wave resonator operates at 371.2 MHz with a Q-factor as high as 1432, enabling highly sensitive current measurement. Experimental results show the current sensor achieved a sensitivity of 325 Hz/mA. This sensor holds promising potential for applications in smart meters, electric vehicle charging stations, and other energy systems.

源语言英语
主期刊名2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
出版商Institute of Electrical and Electronics Engineers Inc.
1067-1070
页数4
ISBN(电子版)9798331508890
DOI
出版状态已出版 - 2025
活动38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025 - Kaohsiung, 中国台湾
期限: 19 1月 202523 1月 2025

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

会议

会议38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
国家/地区中国台湾
Kaohsiung
时期19/01/2523/01/25

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