Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions

Zheng Xie; Cong Wang; Zhi Luo; Ji'An Duan; Lan Jiang

doi:10.1109/ICEPT.2015.7236531

Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions

Zheng Xie, Cong Wang^*, Zhi Luo, Ji'An Duan, Lan Jiang

^*Corresponding author for this work

School of Mechanical Engineering

Central South University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

The controlled, well-characterized evolution of the amplitude envelope and carrier-frequency sweep of ultrafast laser pulses permits measurement and control of quantum transitions on a femtosecond time scale. This opens new perspectives for controlling the transient localized electron dynamics, corresponding material properties and phase change mechanisms, which are critical in laser micro/nano fabrication. In this study, the first-principles calculations and plasma model are used to theoretically investigate the changes of localized transient electron dynamics and the corresponding material properties during femtosecond laser pulse trains ablation of fused silica. Theoretical results show that the electron dynamics including photon absorption, electron excitation and free electron distributions can be changed; the corresponding material properties such as thermal and optical properties can then be controlled; and hence, high quality structures can be obtained.

Original language	English
Title of host publication	16th International Conference on Electronic Packaging Technology, ICEPT 2015
Editors	Hu He, Keyun Bi, Wenhui Zhu
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-7
Number of pages	7
ISBN (Electronic)	9781467379991
DOIs	http://doi.org/10.1109/ICEPT.2015.7236531
Publication status	Published - 1 Sept 2015
Event	16th International Conference on Electronic Packaging Technology, ICEPT 2015 - Changsha, China Duration: 11 Aug 2015 → 14 Aug 2015

Publication series

Name	16th International Conference on Electronic Packaging Technology, ICEPT 2015

Conference

Conference	16th International Conference on Electronic Packaging Technology, ICEPT 2015
Country/Territory	China
City	Changsha
Period	11/08/15 → 14/08/15

Keywords

electron dynamics
laser micro/nano fabrication
laser-material interactions
quantum multiscale modelling

Access to Document

10.1109/ICEPT.2015.7236531

Cite this

Xie, Z., Wang, C., Luo, Z., Duan, JA., & Jiang, L. (2015). Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions. In H. He, K. Bi, & W. Zhu (Eds.), 16th International Conference on Electronic Packaging Technology, ICEPT 2015 (pp. 1-7). Article 7236531 (16th International Conference on Electronic Packaging Technology, ICEPT 2015). Institute of Electrical and Electronics Engineers Inc.. http://doi.org/10.1109/ICEPT.2015.7236531

Xie, Zheng ; Wang, Cong ; Luo, Zhi et al. / Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions. 16th International Conference on Electronic Packaging Technology, ICEPT 2015. editor / Hu He ; Keyun Bi ; Wenhui Zhu. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 1-7 (16th International Conference on Electronic Packaging Technology, ICEPT 2015).

@inproceedings{648772594efd40eb83eb4dc13cbd6bfe,

title = "Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions",

abstract = "The controlled, well-characterized evolution of the amplitude envelope and carrier-frequency sweep of ultrafast laser pulses permits measurement and control of quantum transitions on a femtosecond time scale. This opens new perspectives for controlling the transient localized electron dynamics, corresponding material properties and phase change mechanisms, which are critical in laser micro/nano fabrication. In this study, the first-principles calculations and plasma model are used to theoretically investigate the changes of localized transient electron dynamics and the corresponding material properties during femtosecond laser pulse trains ablation of fused silica. Theoretical results show that the electron dynamics including photon absorption, electron excitation and free electron distributions can be changed; the corresponding material properties such as thermal and optical properties can then be controlled; and hence, high quality structures can be obtained.",

keywords = "electron dynamics, laser micro/nano fabrication, laser-material interactions, quantum multiscale modelling",

author = "Zheng Xie and Cong Wang and Zhi Luo and Ji'An Duan and Lan Jiang",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 16th International Conference on Electronic Packaging Technology, ICEPT 2015 ; Conference date: 11-08-2015 Through 14-08-2015",

year = "2015",

month = sep,

day = "1",

doi = "10.1109/ICEPT.2015.7236531",

language = "English",

series = "16th International Conference on Electronic Packaging Technology, ICEPT 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1--7",

editor = "Hu He and Keyun Bi and Wenhui Zhu",

booktitle = "16th International Conference on Electronic Packaging Technology, ICEPT 2015",

address = "United States",

}

Xie, Z, Wang, C, Luo, Z, Duan, JA & Jiang, L 2015, Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions. in H He, K Bi & W Zhu (eds), 16th International Conference on Electronic Packaging Technology, ICEPT 2015., 7236531, 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Institute of Electrical and Electronics Engineers Inc., pp. 1-7, 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11/08/15. http://doi.org/10.1109/ICEPT.2015.7236531

Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions. / Xie, Zheng; Wang, Cong; Luo, Zhi et al.
16th International Conference on Electronic Packaging Technology, ICEPT 2015. ed. / Hu He; Keyun Bi; Wenhui Zhu. Institute of Electrical and Electronics Engineers Inc., 2015. p. 1-7 7236531 (16th International Conference on Electronic Packaging Technology, ICEPT 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions

AU - Xie, Zheng

AU - Wang, Cong

AU - Luo, Zhi

AU - Duan, Ji'An

AU - Jiang, Lan

PY - 2015/9/1

Y1 - 2015/9/1

N2 - The controlled, well-characterized evolution of the amplitude envelope and carrier-frequency sweep of ultrafast laser pulses permits measurement and control of quantum transitions on a femtosecond time scale. This opens new perspectives for controlling the transient localized electron dynamics, corresponding material properties and phase change mechanisms, which are critical in laser micro/nano fabrication. In this study, the first-principles calculations and plasma model are used to theoretically investigate the changes of localized transient electron dynamics and the corresponding material properties during femtosecond laser pulse trains ablation of fused silica. Theoretical results show that the electron dynamics including photon absorption, electron excitation and free electron distributions can be changed; the corresponding material properties such as thermal and optical properties can then be controlled; and hence, high quality structures can be obtained.

AB - The controlled, well-characterized evolution of the amplitude envelope and carrier-frequency sweep of ultrafast laser pulses permits measurement and control of quantum transitions on a femtosecond time scale. This opens new perspectives for controlling the transient localized electron dynamics, corresponding material properties and phase change mechanisms, which are critical in laser micro/nano fabrication. In this study, the first-principles calculations and plasma model are used to theoretically investigate the changes of localized transient electron dynamics and the corresponding material properties during femtosecond laser pulse trains ablation of fused silica. Theoretical results show that the electron dynamics including photon absorption, electron excitation and free electron distributions can be changed; the corresponding material properties such as thermal and optical properties can then be controlled; and hence, high quality structures can be obtained.

KW - electron dynamics

KW - laser micro/nano fabrication

KW - laser-material interactions

KW - quantum multiscale modelling

UR - http://www.scopus.com/pages/publications/84957809469

U2 - 10.1109/ICEPT.2015.7236531

DO - 10.1109/ICEPT.2015.7236531

M3 - Conference contribution

AN - SCOPUS:84957809469

T3 - 16th International Conference on Electronic Packaging Technology, ICEPT 2015

SP - 1

EP - 7

BT - 16th International Conference on Electronic Packaging Technology, ICEPT 2015

A2 - He, Hu

A2 - Bi, Keyun

A2 - Zhu, Wenhui

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 16th International Conference on Electronic Packaging Technology, ICEPT 2015

Y2 - 11 August 2015 through 14 August 2015

ER -

Xie Z, Wang C, Luo Z, Duan JA, Jiang L. Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions. In He H, Bi K, Zhu W, editors, 16th International Conference on Electronic Packaging Technology, ICEPT 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 1-7. 7236531. (16th International Conference on Electronic Packaging Technology, ICEPT 2015). doi: 10.1109/ICEPT.2015.7236531

Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions

Abstract

Publication series

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this